Staktek Announces Next-Generation, Multi-Die Packaging Technology
Staktek Holdings, Inc. yesterday announced a new multi-die packaging technology platform that delivers improved testability and electrical performance compared to conventional die stacking. Applications for DSD-Pak are ranging from DDR3 multi-die DRAM to high- density Flash and heterogeneous packages including processor plus memories, controller plus memories and various combinations of logic devices.
A package constructed with DSD-Pak technology consists of one or multiple Die-Substrate-Die (DSD) sub-assemblies that are created by attaching a die to each side of a thin substrate. DSD-Pak is compatible with various established die attach technologies, including wire bonding, flip-chip and thermo-compression (TC) / thermo-sonic (TS) bonding. In addition, these sub-assemblies have vertical interconnect features that allow them to be stacked on top of each other to achieve the desired chip content for the final package. DSD-Pak can be adopted with minimal changes to the existing assembly and test infrastructure.
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