Micron set to ramp 40nm production at end of 2009
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Micron Technology is scheduled to kick off volume production using 40nm process technology at its 12-inch wafer fab in Singapore at the end of 2009, according to the company. The US-based memory maker said producing on 40nm coupled with its 6F2 technology will make 40nm the company’s major process technology in 2011, prior to moving to a 4F2 cell design in 2012.
Micron will be able to lower its overall production cost by 50% by moving to 50nm and by another 30% by moving to 40nm, the company said. Its monthly investment per 1,000 wafers can also be reduced from US$12 million for 50nm to US$4 million for 40nm with 6F2, and further to US$2 million for 40nm with 4F2, according to Micron.
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