Intel Will Not Use Lead in Future Microprocessors!
Intel Corporation today announced that its future processors, beginning with its entire family of 45 nanometer (nm) high-k metal gate (Hi-k) processors, are going 100 percent lead-free. The Intel 45nm Hi-k family includes the next-generation Intel Core 2 Duo, Core 2 Quad and Xeon processors, and the company will begin 45nm Hi-k production in the second half of this year.
Due to leads potential impact to the environment and public health, Intel has worked for years with its suppliers and other companies in the semiconductor and electronics industry to develop lead-free solutions as part of its long-standing commitment to environmental practices. In 2002, Intel produced its first lead-free flash memory products. In 2004, the company began shipping products with 95 percent less lead than previous microprocessor and chipset packages. To replace the remaining 5 percent (about .02 grams) of lead solder historically found in the first-level interconnect — the solder joint that connects the silicon die to the package substrate — in processor packages, Intel will use a tin/silver/copper alloy.
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