Intel Completes Next Generation, 32nm Process Development Phase
Intel Corporation has completed the development phase of its next-generation manufacturing process that further shrinks chip circuitry to 32 nanometers (a billionth of a meter). The company is on track for production readiness of this future generation using even more energy-efficient, denser and higher performing transistors in the fourth quarter of 2009.
Intel will provide a multitude of technical details around the 32nm process technology along with several other topics during presentations at the International Electron Devices Meeting (IEDM) next week in San Francisco. Finishing the development phase for the companys 32nm process technology and production readiness in this timeframe means that Intel remains on pace with its ambitious product and manufacturing cadence referred to as the companys tick-tock strategy.
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