IBM To Replace System Bus w/ TSV
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IBM will link chips together in a relatively new way that the company says will improve performance and cut power consumption.
The technology, called through-silicon vias, or TSV, involves connecting different components–processors and memory, for example–or different cores inside of two respective chips through thousands of tiny wires that will carry data back and forth. Now, chips mostly transfer data over channels called buses, which can get overwhelmed, embodied in wires. With TSV, far more data can be transferred per second in a less energy-intensive manner.
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