GIGABYTE at CES 2010 to Extend its USB 3.0 Leadership
GIGABYTE announce today that they will focus on new USB 3.0 SuperSpeed products at CES this year with compatible 3rd party device demos and the introduction of the GA-H57M-USB3 and GA-H55M-USB3 motherboards. These new motherboards are based on yet to be announced chipsets from Intel and increase GIGABYTEs range of SuperSpeed USB 3.0 motherboards to an unequalled 13 models. Cementing the companys leadership in the onboard USB 3.0 motherboard market, GIGABYTE plans to introduce a further 11 motherboard models before the end of January 2010. An extensive list of available and coming soon GIGABYTE USB 3.0 products is available here.
Demonstrating its commitment to developing the USB 3.0 ecosystem, GIGABYTE is working with other USB 3.0 device vendors to ensure cross-compatibility between products. With this in mind, GIGABYTE recently launched the USB 3.0 motherboard microsite that lists compatible 3rd party USB 3.0 devices that include an ultra slim USB 3.0 SSD from OCZ, external hard disk drive (HDD) enclosures from Inxtron and DoTop, an HDD docking station from Sharkoon and other USB 3.0 accessories from DoTop. More 3rd party USB devices are currently undergoing testing so watch this space for more exciting new SuperSpeed action.
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