Double the cores, double the chip heat?
The earth may be heating up, but Intel and Advanced Micro Devices are determined to keep PC warming trends in check. The article over at CNET is an interesting read and talks about quad-core Kentsfield moving over to a 45nm process next year!
Intel, fresh off the launch of its Core 2 Duo chips, has announced plans to accelerate the introduction of a quad-core processor called Kentsfield, now expected in the fourth quarter. Not to be outdone, AMD later this year will release a product called “4×4,” which is two AMD processors connected together on a high-end motherboard. Intel hasn’t announced specific plans for quad-core processors beyond Kentsfield, Alfs said. Sources familiar with Intel’s plans have indicated that when the company is ready to move from its current 65-nanometer manufacturing process to a 45-nanometer one next year, it will start with dual-core chips to make the transition easier. And then at some later date, it will be ready to build quad-core chips with the smaller 45-nanometer transistors on a single piece of silicon, unlike the multichip package used for Kentsfield.
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