Honeywell Announces New Thermal Management Material – PCM45M-SP
Honeywell Electronic Materials announced today a new printable thermal management material called PCM45M-SP that is designed to help manage the tremendous heat produced by increasingly powerful semiconductors in portable computing devices such as laptops and netbooks. PCM45M-SP can withstand more than 1,000 hours at 150 degrees C without degradation and more than 1,000 temperature cycles. The application is not limited to heat sink design, and the material may be applied to a component, heat sink or thermal spreader in any shape built into the printing screen. Additionally, the enhanced stability of this new material minimizes or eliminates the need for pre-mixing, conserving time and resources. The PCM45M-SP phase change thermal interface consists of a sophisticated thermally conductive material with optimum filler size distribution to achieve maximum packing density compared with conventional phase change materials. PCM45M-SP changes phase at 45 degrees C to ensure maximum surface conformance.
“Mobile computing devices such as laptops and netbooks are placing increased demands on thermal management materials to enable high performance and ensure a long lifespan,” said Tim Chen, packaging leader for Honeywell Electronic Materials. “To meet that challenge, we have combined our industry leading phase-change chemistry with an innovative formulation specifically designed for these types of mobile devices.”
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