AMD Announces New Dual-Core 18W TDP Processors
AMD today announced immediate availability of two new dual-core, 18W TDP processors for the highly-scalable ASB1 BGA embedded client platform. The AMD Turion Neo X2 processor Model L625 and the AMD Athlon Neo X2 processor Model L325 deliver PC-caliber performance in a very low power envelope and with an embedded-friendly ball grid array (BGA) package. Systems based on the new dual-core processors are expected at launch from industry-leading embedded system providers IBASE and IEI, among others.
The addition of these new dual-core processors to the ASB1 BGA platform can help increase the performance of existing single-core designs. When combined with either the AMD 780E or M690E chipset, embedded system designers can take advantage of a complete x86-based solution that can help streamline development, minimize time to market and offers leading-edge graphics capability, which is increasingly important in many embedded markets. All of AMDs embedded products are offered with industry-standard 5-year component longevity.
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