Cray and Intel Collaborate to Develop Future Supercomputing Technologies
Cray Inc. and Intel Corporation announced yesterday that they signed a multi-year agreement to advance high-performance computing (HPC) on Intel microprocessors while delivering broad new Intel and Cray technologies in future Cray server systems. The collaboration of these two industry leaders will result in HPC systems that will help solve some of the world’s most complex scientific, engineering and humanitarian challenges.
The two companies plan to explore future supercomputer component designs such as multi-core processing and advanced interconnects. As a result of this collaboration, Cray and Intel plan to develop a range of HPC systems and technologies over the next several years. “Cray’s commitment to Intel is a testament of our commitment to HPC and the strength of our hardware and software roadmap and many-core research,” said Patrick Gelsinger, senior vice president and general manager of Intel’s Digital Enterprise Group. “Throughout Cray’s history, it has been an innovator in high-end HPC while Intel has pushed the boundaries of processor technology.
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