Sub-ambient cooling isn’t a very common form of cooling for computers and most enthusiasts that do engage in it typically use single-stage phase change systems. The next step up from that would be dry ice and then liquid nitrogen is the typical peak in cooling capability. While testing the Gigabyte GA-MA790GP-DS4H under liquid nitrogen I snapped a few shots of my insulation process and the end results.
I will be using the above board for this short guide. It was one of the first boards qualified for Phenom II operation and it has been my main AM2+ board since.
Before you can start insulating you need to prepare the motherboard. For AM2/AM2+/AM3 motherboards you need to remove the heatsink mounting bracket. For LGA775/LGA1366 motherboards, there is nothing around the socket that you need to remove.
With the mounting bracket removed you should have a clear socket. Notice the little components around the socket, these will corrode and short if you don’t insulate.