OCZ Technology Group today unveiled a number of ground-breaking, next generation products at the 2008 Consumer Electronics Show that we were able to take a look at just hours ago.
As the leader in high performance memory, OCZ is showcasing ultra-high speed DDR3 solutions designed for the extreme enthusiast. The latest Flex archetype, Flex2, offers superior cooling with dedicated liquid channels over the chips themselves enabling advanced overclocking and stability for the highest performing parts. The original OCZ Flex kits channeled water over the top of the module to help cool them. The new Flex2 modules now have water flow along each side, which means the coolant flow is directly above the memory chips. This means Flex2 kits have improved cooling, but require four water connections per module versus just two on the original Flex kits.
Since the water has to flow over the memory IC’s the Flex2’s are thicker than traditional heat spreaders and as a result memory modules can not be run side by side. If you want to run four of these side by side it is not physically possible.
To get a better idea of what they look like with all the coolant lines hooked up the above picture is worth a million bucks. OCZ will include Y-adapters with each Flex2 kit that will reduce the size of the water lines to the correct inlet and outlet size for the water cooled heat spreaders. If you look closely at the picture above you’ll also spot a new product that has not been seen before.
As a complementary liquid cooling solution OCZ further expands into water cooling accessories with the introduction the HydroFlow CPU waterblock unit to cool the most powerful processors. The HydroFlow was designed with the highest possible exchange rate between the block and the coolant with the unique triangular fin design, and is the preeminent way to efficient cooling for overclocked CPUs. OCZ includes a variety of water barbs, so enthusiasts shouldn’t have to hunt down parts to make the HydroFLow work on their rig.