I see this idea dying on the drawing board. I personally think Pelts are not worth the issues they cause. there are other obvious issues which are touched upon in the article….. but we’ll see.
“AN AMD PATENT approved on October the 5th last has interesting implications for the system builder future.
US patent number 6,800,933 was filed on the 23rd of April 23, with the following abstract: “Various embodiments of a semiconductor-on-insulator substrate incorporating a Peltier effect heat transfer device and methods of fabricating the same are provided. In one aspect, a circuit device is provided that includes an insulating substrate, a semiconductor structure positioned on the insulating substrate and a Peltier effect heat transfer device coupled to the insulating substrate to transfer heat between the semiconductor structure and the insulating substrate.””