SK Hynix announced that it has developed the world’s first 8Gb (Gigabit) LPDDR3 (Low Power DDR3) using its advanced 20nm class process technology. This product is a top-performance mobile memory solution which features high density, ultrahigh speed and low power consumption. The product works at 2133Mbps which surpasses 1600Mbps of existing LPDDR3 in the aspect of its data transmission speed and is the world’s fastest mobile DRAM. With a 32-bit I/O it processes up to 8.5GB of data per second in a single channel, and 17GB in a dual channel. It works at ultra low-voltage of 1.2V. Samples of this new product have been shipped to customers and the SK Hynix plans to start mass production of it at the end of this year.
“With the development of this high density LPDDR3 using 20nm class, SK Hynix is now able to supply a top-performance product suitable for mobile devices to the market”, Senior Vice President Richard Chin, the Head of Global Sales & Marketing said. “Especially, this development has its significance since the Company has secured top-level competitiveness in mobile products by developing it simultaneously with PC DRAM using the same 20nm class process technology” he added.