Many enthusiasts and overclockers know that the space between the memory sockets is very tight, so a water cooled heat spreader design has to be well done. Due to this reason OCZ designed their heat spreader to run water on top of the module itself rather than directly on top of the IC’s. Those that follow the water cooling industry know that this method of water cooling memory modules is also not new as Thermaltake has had the Aqua RX Series-RA Memory Liquid Heatsink (CL-W0102) on the market for some time now. OCZ feels that their cooler is of higher quality since it is made from copper and has a better design and cooling fins to boot.
Taking a look at the OCZ FlexXLC heat spreader it certainly looks better and has a more ‘finished’ look to it.
Those with a sharp eye will notice that one side of the heat spreader is thick and the other side is flat. This was done so that two modules with FlexXLC heat spreaders could be installed next to each other. OCZ says that they have only encountered a limited number of boards that they are having problems getting modules to fit, so that is good news to those who run four modules in their gaming rig.
Here is a shot of one of the modules in the test system over at test bench at OCZ’s office. The back heat spreader is copper and looks to screw into the water cooled section that runs along the top of the memory module. Since the heat spreader is two pieces OCZ informed Legit Reviews that they have used a new thermal adhesive to attach the FlexXLC to the modules. The new thermal compound should also improve the heat transfer between the IC’s and the new water cooled heat spreaders.