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Intel Invests $650 Million In U.S. Manufacturing Site

Intel Corporation today announced plans to invest $650 million in the company?s existing manufacturing site in New Mexico. The investment will be used to increase the capacity of the 300mm wafer fabrication facilities in Rio Rancho, N.M., called Fab 11X. It is good to see Intel pumping this kind of money into a location here in the states!

This investment is part of Intel?s strategic goal to increase manufacturing on 300mm wafers that use 90nm, 65nm and future process technologies. Intel has several fabs manufacturing with 300mm wafers today. These facilities are Fab 11X in New Mexico, D1D and D1C in Oregon and Fab 24 in Ireland. Manufacturing with 300mm wafers (about 12 inches in diameter) dramatically increases the ability to produce semiconductors at a lower cost compared with more widely used 200mm (eight-inch) wafers. The total silicon surface area of a 300mm wafer is 225 percent, or more than twice that of a 200mm wafer, and the number of printed die (individual computer chips) is increased to 240 percent. The bigger wafers lower the production cost per chip while diminishing overall use of resources.

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Posted by | Tue, Oct 25, 2005 - 07:01 AM