Intel and TSMC tested 32nm development prototypes – Looks Good!
While the semiconductor industry has yet to migrate to 45nm production, major players, such as Intel and Taiwan Semiconductor Manufacturing Company (TSMC), are already gearing up the development of the 32nm node. Intel’s director of technology strategy Paolo A Gargini yesterday described the US chip giant’s development of its 32nm process as being “in good shape.” Speaking at the International Technology Roadmap for Semiconductors (ITRS) forum being held in Hsinchu, Taiwan, Gargini said Moore’s Law is expected to apply for 10-15 years more.
Industry sources pointed out that TSMC is also seeing breakthroughs in its development at the 32nm node. The world’s number-one pure play foundry has already conducted a few tests on 32nm wafer prototypes, the sources said. TSMC CEO Rick Tsai recently revealed that the company has an ad hoc team devoted to the development of 32nm technology. According to ITRS’s estimation, products at the 22nm node may not be available on the market until 2015 at the earliest. As for 32nm processes, the industry is still probing the pros and cons of adopting extreme ultraviolet (EUV) or double-exposure 193i immersion lithography, according to ITRS
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