Corsair XMS 3200XL Memory

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What is under the heat spreader?

Hyper X - detail

Once I removed the heat spreaders I found one of the newest Samsung IC’s on the market for high speed memory modules — Samsung TCCD Revision F’s. The full part number was found to be K4H560838F-TCCD. For those of you who don’t know, these IC’s from Samsung are in the TSOP form factor and are rated by samsung at 4ns. Actually, the Samsung TCCD IC’s come rated at 500MHz, but with relaxed timings of 3-4-4. After removing the heat spreader I found some pretty great IC’s in terms of overclocking. These 400MHz modules are using IC’s that Samsung rates at 500Mhz. This should make overclocking very interesting.

Decoding The IC:

For those of you that want to know the inside scoop on everything we broke down what the codes on the IC mean below. If you would like to do this on one of your personal modules or to double check us you can find the most current decoder right here on the Samsung site. (Note the final D is not on the .pdf, but we have an internal Samsung document that shows it and the following information is correct)

Samsung K4H560838F-TCCD

Specification

Feature

Decoding

Samsung K4H560838F-TCCD

K4

Samsung

H

DDR SDRAM

56

256M 8K Refresh

08

organization = 8

3

4 Banks

8

Interface = SSTL_2 2.5V

F

Generation #7

T

TSOP Package

C

Normal Temperature Range

CD

4.0ns @ DDR500 3-4-4

Key Features:

  • Memory amount: 2 x 512MB
  • Access time: 4.0ns Samsung TCCD Rev “F” IC’s
  • 400MHz (PC-3200) Unbuffered DDR Modules
  • CAS latency: 2 clock cycles
  • RAS precharge: 2 cycles
  • RAS active to precharge: 5 cycles
  • Command rate: 1T (1 cycle)
  • Black heat spreader for thermal diffusion
  • Latency: 2-2-2-5-1T
  • 2.75V
  • Lifetime Warranty

Now that we know what the memory is rated for by Corsair and what exact IC’s are being used on the Corsair XMS 3200XL memory kit we can look at our testing to see how it really performs.

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