Corsair DHX technology provides maximum cooling for the memory module as it uses extruded aluminum heat sinks to remove heat from both the PCB and in this case the Samsung memory ICs. The design has been in use for well over a year now and has been proven to work time and time again.
With all the heat spreaders removed we can get a glimpse of the new Samsung IC’s which are what separates these modules from the rest that Corsair and other companies have on the market today. The markings on the IC’s show the part number of K4B1G0846D-HCF0, which is one of the newer tray parts from Samsung. From what I understand, Corsair orders trays of these unsorted memory chips and sorts them in-house for use on the TW3X4G1600C9DHXNV memory kits. It would make logical sense that the fallout from the sorting process will be used on other modules, but none are in production as of yet.
In case you missed something here are the key features of the memory kit: