ADATA today launched a successor to the company’s popular XPG DRAM lineup. The new XPG V2 series have colorful and visually striking heat spreaders and are designed for 3rd Generation Intel Core i ‘Haswell’ Processors and the Z87 platform. The XPG V2 modules all feature 2oz copper, 8 layer PCB (Printed Circuit Board) aluminum heat spreaders employing Thermal Conductive Technology (TCT). Additionally, the heat spreaders have been re-designed with a futuristic form that will appeal to those who take pride in both the performance and the visual outlook of their high-end system. The 2800 MHz memory runs at timings of CL 12-14-14-36 at 1.65 volts, delivering the performance demanded by gamers and power users. The XPG V2 will come in dual channel kits of 8GB and 16GB (4GB x 2 and 8GB x 2).
ADATA XPG V2 memory products are made in conformation with JEDEC regulations and DDR3-1333 standards at CL value of 9-9-9-24 . Each XPG V2 memory chip is selected through a strict filtering process, complete with high-quality PCBs (Printed Circuit Board) and an aluminum heat sink that effectively lowers module temperature, proven to reach a maximum speed of 2800MHz at CL value 12-14-14-36 to make complete use of the computer’s power.